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SFPC課題組高導熱PBO納米復合紙工作發(fā)表在Nano-Micro Letters上

Lin Tang, Kunpeng Ruan, Xi Liu, Yusheng Tang*, Yali Zhang and Junwei Gu*. Flexible and robust functionalized boron nitride/poly(p-phenylene benzobisoxazole) nanocomposite paper with high thermal conductivity and outstanding electrical insulation. Nano-Micro Letters, 2024, 16: 38. 2023IF=31.6 (1區(qū)材料科學Top期刊,中國科技期刊卓越行動計劃-領軍類期刊項目)

https://doi.org/10.1007/s40820-023-01257-5

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare benzidine functionalized boron nitride (m-BN). And the m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures prepared via sol-gel film transformation approach.The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π-π electron interaction between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ∥and λ⊥are 9.68 W/(m·K) and 0.84 W/(m·K), and the volume resistivity & breakdown strength are as high as 2.3×1015Ω·cm and 324.2 kV/mm, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640oC, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

隨著5G信息技術的快速發(fā)展,高集成化的電子器件和電氣設備的導/散熱問題愈加突出,亟需設計制備出兼具優(yōu)異導熱性能和電絕緣性能的聚合物基復合紙。本文采用“高溫固相-重氮鹽分解”法將聯苯胺接枝在氮化硼(BN)表面制備功能化BN(m-BN),與有機酸解離制備的聚對苯撐苯并二噁唑納米纖維(PNF)復合,采用“溶膠-凝膠”薄膜轉化工藝制備仿貝殼珍珠層結構的m-BN/PNF納米復合紙。基于m-BN與PNF之間的氫鍵、π-π電子相互作用以及內部的仿貝殼珍珠層結構,50 wt% m-BN的m-BN/PNF納米復合紙展現出優(yōu)異的導熱性能、出色的電絕緣性能、優(yōu)異的力學性能和突出的熱穩(wěn)定性,其λ∥和λ⊥分別為9.68 W/(m·K)和0.84 W/(m·K),體積電阻率和擊穿強度分別高達2.3×1015 Ω·cm和324.2 kV/mm,拉伸強度為193.6 MPa,熱分解溫度為640oC,有望在電子器件和電氣設備等高端熱管理領域獲得廣泛的應用。


論文亮點

1. 基于功能化氮化硼與PNF的π-π作用,誘導BN均勻分布在PNF網絡中,賦予納米復合紙優(yōu)異的導熱性能和突出的熱管理能力。

2. 采用溶膠-凝膠薄膜轉化工藝,在m-BN/PNF納米復合紙中構筑仿貝殼珍珠層結構,其拉伸強度和拉伸模量高達193.6 MPa、3.72 GPa。

3. 基于有序的層狀結構,帶電載流子納米復合紙中進行多次遷移,使其體積電阻率和擊穿強度分別高達2.3×1015 Ω·cm和324.2 kV/mm。


第一作者:唐林

郵件地址:tanglin@cqnu.edu.cn

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