[Nano-Micro Letters] Breaking Through Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics
作者：Junwei Gu*, Kunpeng Ruan
關(guān)鍵字：Thermally conductive composites
論文來源：期刊
具體來源：Nano-Micro Letters
發(fā)表時(shí)間：2021年
Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible direction for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance (ITR) in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.
能源、電氣和電子技術(shù)的高速發(fā)展對高分子及其復(fù)合材料的導(dǎo)熱性能提出了更高的要求。然而，目前制備的導(dǎo)熱高分子復(fù)合材料的導(dǎo)熱系數(shù)（λ）大多仍然難以達(dá)到預(yù)期，已成為導(dǎo)熱高分子復(fù)合材料領(lǐng)域內(nèi)一大瓶頸問題。針對此，本文基于相關(guān)研究者與本課題組前期研究工作的積累，提出了突破瓶頸的三個(gè)可能方向——制備合成本征型導(dǎo)熱高分子材料、降低導(dǎo)熱高分子復(fù)合材料中的界面熱障以及建立并研究合適的導(dǎo)熱模型與機(jī)理指導(dǎo)實(shí)驗(yàn)優(yōu)化，并對三個(gè)方向未來的發(fā)展趨勢進(jìn)行前瞻，希冀為導(dǎo)熱高分子及其復(fù)合材料的制備、研究與發(fā)展提供一定的依據(jù)與指導(dǎo)。