【Journal of Materials Science: Materials in Electronics】Deposition of Cu–Mn alloy film from supercritical carbon dioxide for advanced interconnects
作者：Bin Zhao, Yanfei Zhang, Junhe Yang
關鍵字：Cu-Mn, Supercritical CO2
論文來源：期刊
具體來源：Journal of Materials Science: Materials in Electronics, 2013, 24: 4439–4444.
發(fā)表時間：2013年
Cu–Mn alloy films for microelectronic interconnects were deposited by H2 reduction of bis(2,2,6,6-tetramethyl-3,5-heptanedionato)-copper(II) [Cu(tmhd)2] and bis(penta-methylcyclopentadienyl)-manganese [Mn(pmcp)2] in supercritical carbon dioxide (scCO2). 20-nm thick and continuous Cu–Mn films with a smooth surface were deposited at the temperature of 210 °C. Manganese was found to be segregated to film surface and its content on the surface increased with increasing Mn precursor concentration in scCO2. Mn addition by supercritical fluid deposition could improve surface quality of the Cu film. And electrical resistivity of the Cu–Mn films increased with the Mn contents in the film.