(ACS Applied Materials & Interfaces) Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics
writer：Jihai Zhang, Jin Feng, Liyang Jia, Huiyuan Zhang, Gaixia Zhang, Shuhui Sun,* and Tao Zhou*
keywords：Organocopper; polymer; laser activation; selective metallization; laser-induced
source：期刊
Issue time：2019年
Our work proposed a facile strategy for selective fabricating the precise metalized patterns onto polymer substrates through laser direct structuring (LDS) technology using organocopper compounds. The copper oxalate (CuC2O4) and copper acetylacetonate [Cu(acac)2] which acted as laser sensitizer were first introduced into acrylonitrile-butadiene-styrene (ABS) matrix for prepare LDS materials. After the activation with 1064 nm pulsed near-infrared (NIR) laser, the Cu0 (metal copper) was generated from the CuC2O4 and Cu(acac)2, and then served as catalyst species for the electroless copper plating. A series of characterizations were conducted to investigate the morphology and analyze the surface chemistry of ABS/CuC2O4 and ABS/Cu(acac)2 composites. Specially, the X-ray photoelectron spectroscopy (XPS) analysis indicated that 58.3% Cu2+ in ABS/CuC2O4 was reduced to Cu0, while this value was 63.9% for the ABS/Cu(acac)2. After 30 min electroless copper plating (ECP), the conductivity of copper circuit on ABS/CuC2O4 and ABS/Cu(acac)2 composites were 1.22 × 107 Ω?1·m?1 and 1.58 × 107 Ω?1·m?1, respectively. Moreover, the decorated patterns and near field communication (NFC) circuit were demonstrated by this LDS technology. We believe that this study paves the way for developing organocopper-based LDS materials, which has the potential for industrial applications.